Modified nitride particles, oligomer functionalized nitride particles, polymer based composites and methods of forming thereof

ABSTRACT

A surface modified nitride particle including a nitride particle covalently bonded via a urethane moiety to an aromatic compound. The surface modified nitride particle may further include at least two auxiliary moieties for bonding to oligomers.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation of and claims priority under 35U.S.C. § 120 to U.S. patent application Ser. No. 15/392,699, entitled“MODIFIED NITRIDE PARTICLES, OLIGOMER FUNCTIONALIZED NITRIDE PARTICLES,POLYMER BASED COMPOSITES AND METHODS OF FORMING THEREOF,” by NazilaDadvand et al., filed on Dec. 28, 2016, which claims priority under 35U.S.C. § 119(e) to U.S. Provisional Application No. 62/273,078, entitled“MODIFIED NITRIDE PARTICLES, OLIGOMER FUNCTIONALIZED NITRIDE PARTICLES,POLYMER BASED COMPOSITES AND METHODS OF FORMING THEREOF,” by NazilaDadvand et al., filed on Dec. 30, 2015, which are assigned to thecurrent assignee hereof and are incorporated herein by reference intheir entireties.

FIELD OF THE DISCLOSURE

The following is directed to a method of surface modifying nitrideparticles and incorporation of the same in a polymer based composite.More particularly, the following is directed to a method of surfacemodifying boron nitride particles and incorporation of the same in apolymer based composite.

DESCRIPTION OF THE RELATED ART

Nitride particles may be utilized as a filler material added to polymerbased composites as thermal fillers, to enhance mechanical properties ofthe composites, such as material wear resistance or peel strength, or asa solid lubricant. However, nitride particles are very difficult todisperse uniformly within an organic polymer matrix. Low dispersion ofthe nitride particles minimizes any beneficial effect that the fillermaterial may have in the polymer based composite.

Accordingly, the industry continues to demand improved nitride particlefiller material that is more dispersible within a polymer basedcomposite while still maintaining its ability to improve thermalconductivity, peel strength and other mechanical properties of thepolymer based composite.

SUMMARY

According to a first aspect, a surface modified nitride particle mayinclude a nitride particle covalently bonded via a urethane moiety to anaromatic compound. The surface modified nitride particle may furtherinclude at least two auxiliary moieties.

According to another aspect, a method of forming a modified nitrideparticle may include activating a nitride particle to form at least onehydroxyl group and chemically reacting an aromatic compound with the atleast one hydroxyl group on the nitride particle. The aromatic compoundmay include at least two auxiliary moieties.

According to yet another aspect, an oligomer functionalized nitrideparticle may include a nitride particle, an aromatic compound covalentlybonded via a urethane moiety to the nitride particle and at least twooligomers covalently bonded to the aromatic compound via at least twoauxiliary moieties of the aromatic compound.

According to still another aspect, a method of forming an oligomerfunctionalized nitride particle may include activating a nitrideparticle to form at least one hydroxyl group, chemically reacting anaromatic compound with the at least one hydroxyl group on the nitrideparticle. The aromatic compound may include at least two auxiliarymoieties. The method may further include chemically reacting at leasttwo oligomers covalently bonded to the aromatic compound via the atleast two auxiliary moieties.

According to yet another aspect, a polymer based composite may includeat least one polymer component and a modified nitride filler materialdispersed within the polymer component. The modified nitride fillermaterial may include a nitride particle, an aromatic compound covalentlybonded via a urethane linkage to the nitride particle and at least twooligomer components covalently bonded to the aromatic compound.

According to still another aspect, a method of forming a polymer basedcomposite may include combining at least one polymer component with anitride filler material of oligomer functionalized nitride particles.The oligomer functionalized nitride particles may include a nitrideparticle, an aromatic compound covalently bonded via a urethane linkageto the nitride particle and at least two oligomer components covalentlybonded to the aromatic compound.

BRIEF DESCRIPTION OF THE FIGURES

The present disclosure may be better understood, and its numerousfeatures and advantages made apparent to those skilled in the art byreferencing the accompanying drawings.

FIG. 1 includes an illustration of a flow diagram of a process forforming a modified nitride particle according to embodiments describedherein;

FIG. 2 includes an illustration of a flow diagram of a process forforming an oligomer functionalized nitride particle according toembodiments described herein;

FIG. 3 includes an illustration of a flow diagram of a process forforming polymer based composite that includes oligomer functionalizednitride particles according to embodiments described herein; and

FIG. 4 includes a plot comparing the peel strength of a sample polymerbased composite formed according to an embodiment described herein withtwo comparison sample polymer based composites.

Skilled artisans appreciate that elements in the figures are illustratedfor simplicity and clarity and have not necessarily been drawn to scale.For example, the dimensions of some of the elements in the figures maybe exaggerated relative to other elements to help to improveunderstanding of embodiments of the invention.

DETAILED DESCRIPTION

The following is directed to methods of forming a modified nitrideparticle, a modified nitride particle, methods of forming an oligomerfunctionalized nitride particle, an oligomer functionalized nitrideparticle, methods of forming a polymer based composite includingoligomer functionalized nitride particles, and a polymer based compositeincluding oligomer functionalized nitride particles.

Referring first to methods of forming a surface modified nitrideparticle, FIG. 1 illustrates a nitride particle surface modificationprocess 100. Surface nitride particle modification process 100 mayinclude a first step 110 of providing a nitride particle, a second step120 of activating the surface of the nitride particle by creating atleast one hydroxyl group, a third step 130 of chemically reacting anaromatic compound with the at least one hydroxyl group on the nitrideparticle.

According to certain embodiments, surface nitride particle modificationprocess 100 may include modifying any nitride particle suitable forsurface modification according to embodiments described herein.According to certain embodiments, the nitride particle may be acrystalline nitride particle or a partially crystalline nitrideparticle. According to still other embodiments, the nitride particle maybe a boron nitride particle or a silicon nitride particle. According tostill other embodiments, the boron nitride particle may be a cubic boronnitride particle. According to yet other embodiments, the boron nitrideparticle may be a hexagonal boron nitride particle.

Referring to second step 120, activating the surface of the nitrideparticle by creating at least one hydroxyl group may include applying anultrasonic treatment to the nitride particle. According to still otherembodiments, applying the ultrasonic treatment may include applying anultrasonic treatment with hydrogen peroxide to the nitride particle.According to yet another embodiment, applying the ultrasonic treatmentmay include applying an ultrasonic treatment in a water based system.According to still other embodiments, applying the ultrasonic treatmentmay include applying an ultrasonic treatment in suspension. According toyet another embodiment, activating the surface of the nitride particleby creating at least one hydroxyl group may include applying a thermaltreatment to the nitride particle.

According to still other embodiments, activating the surface of thenitride particle may include preferentially creating hydroxyl groups onthe surface of the nitride particles. It will be appreciated thatpreferentially creating hydroxyl groups on the surface of the nitrideparticle may be understood to mean that a majority of the polar groupscreated on the surface of the nitride particle are hydroxyl groups. Forexample, preferentially creating hydroxyl groups on the surface of thenitride particle may include creating more hydroxyl groups than polaramine groups.

Referring to third step 130, chemically reacting an aromatic compoundwith the at least one hydroxyl group on the nitride particle may includecreating a covalent bond between the aromatic compound and the nitrideparticle. According to still other embodiments, creating a covalent bondbetween the aromatic compound and the nitride particle may includecreating a covalent bond via a urethane linkage to the nitride particle,as illustrated here:

where NP represents the nitride particle and AR represents the aromaticcompound.

According to still other embodiment, the aromatic compound may include aparticular number of aromatic rings. For example, the aromatic compoundmay include at least one aromatic ring, such as, at least two aromaticrings or even at least three aromatic rings.

According to still other embodiments, the aromatic compound may includemultiple isocyanate moieties. For example, the aromatic compound mayinclude at least two isocyanate moieties, such as, at least threeisocyanate moieties, at least four isocyanate moieties, five isocyanatemoieties.

According to yet another embodiment, the aromatic compound may includedi-isocyanate. According to still another embodiment, the aromaticcompound may include tri-isocyanate. According to another embodiment,the aromatic compound may include 4-isocyanate. According to yet anotherembodiment, the aromatic compound may include 5-isocyanate. According toyet another embodiment, the aromatic compound may include 6-isocyanate.

According to yet other embodiments, the aromatic compound may includemultiple auxiliary moieties. It will be appreciated that an auxiliarymoiety may be defined as a moiety bonded to the aromatic compound butnot to the nitride particle. According to particular embodiments, thearomatic compound may include at least two auxiliary moieties, such as,at east three auxiliary moieties, at least four auxiliary moieties oreven at least five auxiliary moieties.

According to still other embodiments, the aromatic compound may includeparticular auxiliary moieties. For example, the aromatic compound mayinclude a phenyl moiety, a biphenyl moiety, a naphthyl moiety, aphenanthryl moiety, a methylene-diphenyl moiety, a triphenyl-methanemoiety or any combination thereof.

According to certain embodiments, nitride particle surface modificationprocess 100 may be described according to the following reaction scheme:

where NP represents the nitride particle, AR represents the aromaticcompound, AM1 represents the first auxiliary moiety and AM2 representsthe second auxiliary moiety.

According to particular embodiments, NP may be any nitride particlesuitable for surface modification according to embodiments describedherein. According to certain embodiments, the NP may be a crystallinenitride particle or a partially crystalline nitride particle. Accordingto still other embodiments, the NP may be a boron nitride particle or asilicon nitride particle. According to still other embodiments, the NPmay be a cubic boron nitride particle. According to yet otherembodiments, the NP may be a hexagonal boron nitride particle.

According to other embodiments, the AR may include a particular numberof aromatic rings. For example, AR may include at least one aromaticring, such as, at least two aromatic rings or even at least threearomatic rings.

According to still other embodiments, the AR may include multipleisocyanate moieties. For example, the aromatic compound may include atleast two isocyanate moieties, such as, at least three isocyanatemoieties, at least four isocyanate moieties, five isocyanate moieties.

According to yet another embodiment, the AR may include di-isocyanate.According to still another embodiment, the AR may includetri-isocyanate. According to another embodiment, the AR may include4-isocyanate. According to yet another embodiment, the AR may include5-isocyanate. According to yet another embodiment, the AR may include6-isocyanate.

According to yet another embodiment, the AR may include any aromaticcompound as illustrated here:

According to still other embodiments, the AM1 and AM2 may be the sameauxiliary moieties. According to still other embodiments, the AM1 andAM2 may be different auxiliary moieties. According to yet otherembodiments, AM1 and AM2 may be selected from OH, SH, NH₂, F, Cl, Br, I,COOH, CN, OCN, CNO, NCS or any combination thereof.

It will be appreciated that, though not shown in the formula above, thesurface modified nitride particle may include more auxiliary moieties,such as, for example, AM3, AM4, AM5, AM6 and any such additionalauxiliary moieties may further be selected from OH, SH, NH₂, F, Cl, Br,I, COOH, CN, OCN, CNO, NCS or any combination thereof.

Referring now to the surface modified nitride particle formed accordingto embodiments described herein, the surface modified nitride particlemay include a nitride particle covalently bonded via a urethane linkageto an aromatic compound. The surface modified nitride particle mayfurther include at least two auxiliary moieties.

According to certain embodiments, the nitride particle of the surfacemodified nitride particle may be any nitride particle suitable forsurface modification according to embodiments described herein.According to certain embodiments, the nitride particle may be acrystalline nitride particle or a partially crystalline nitrideparticle. According to still other embodiments, the nitride particle maybe a boron nitride particle or a silicon nitride particle. According tostill other embodiments, the boron nitride particle may be a cubic boronnitride particle. According to yet other embodiments, the boron nitrideparticle may be a hexagonal boron nitride particle.

According to other embodiments, the aromatic compound of the surfacemodified nitride particle may include a particular number of aromaticrings. For example, the aromatic compound may include at least onearomatic ring, such as, at least two aromatic rings or even at leastthree aromatic rings.

According to still other embodiments, the aromatic compound of thesurface modified nitride particle may include multiple isocyanatemoieties. For example, the aromatic compound may include at least twoisocyanate moieties, such as, at least three isocyanate moieties, atleast four isocyanate moieties, five isocyanate moieties.

According to yet another embodiment, the aromatic compound of thesurface modified nitride particle may include di-isocyanate. Accordingto still another embodiment, the aromatic compound of the surfacemodified nitride particle may include tri-isocyanate. According toanother embodiment, the aromatic compound of the surface modifiednitride particle may include 4-isocyanate. According to yet anotherembodiment, the aromatic compound of the surface modified nitrideparticle may include 5-isocyanate. According to yet another embodiment,the aromatic compound of the surface modified nitride particle mayinclude 6-isocyanate.

According to yet other embodiments, the aromatic compound of the surfacemodified nitride particle may include multiple auxiliary moieties. Itwill be appreciated that an auxiliary moiety may be defined as a moietybonded to the aromatic compound but not to the nitride particle.According to particular embodiments, the aromatic compound may includeat least two auxiliary moieties, such as, at east three auxiliarymoieties, at least four auxiliary moieties or even at least fiveauxiliary moieties.

According to still other embodiments, the aromatic compound of thesurface modified nitride particle may include particular auxiliarymoieties. For example, the aromatic compound of the surface modifiednitride particle may include a phenyl moiety, a biphenyl moiety, anaphthyl moiety, a phenanthryl moiety, a methylene-diphenyl moiety, atriphenyl-methane moiety or any combination thereof.

According to certain embodiments, the surface modified nitride particleformed according to embodiments described herein may be described as acompound having the following formula:

where NP represents the nitride particle, AR represents the aromaticcompound, L represents the urethane linkage between the nitride particleand the aromatic compound, AM1 represents the first auxiliary moiety andAM2 represents the second auxiliary moiety.

According to particular embodiments, NP may be any nitride particlesuitable for surface modification according to embodiments describedherein. According to certain embodiments, the NP may be a crystallinenitride particle or a partially crystalline nitride particle. Accordingto still other embodiments, the NP may be a boron nitride particle or asilicon nitride particle. According to still other embodiments, the NPmay be a cubic boron nitride particle. According to yet otherembodiments, the NP may be a hexagonal boron nitride particle.

According to other embodiments, the AR may include a particular numberof aromatic rings. For example, AR may include at least one aromaticring, such as, at least two aromatic rings or even at least threearomatic rings.

According to still other embodiments, the AR may include multipleisocyanate moieties. For example, the aromatic compound may include atleast two isocyanate moieties, such as, at least three isocyanatemoieties, at least four isocyanate moieties, five isocyanate moieties.

According to yet another embodiment, the AR may include di-isocyanate.According to still another embodiment, the AR may includetri-isocyanate. According to another embodiment, the AR may include4-isocyanate. According to yet another embodiment, the AR may include5-isocyanate. According to yet another embodiment, the AR may include6-isocyanate.

According to yet another embodiment, the AR may include any aromaticcompound as illustrated here:

According to still other embodiments, the AM1 and AM2 may be the sameauxiliary moieties. According to still other embodiments, the AM1 andAM2 may be different auxiliary moieties. According to yet otherembodiments, AM1 and AM2 may be selected from OH, SH, NH₂, F, Cl, Br, I,COOH, CN, OCN, CNO, NCS or any combination thereof.

It will be appreciated that, though not shown in the formula above, thesurface modified nitride particle may include more auxiliary moieties,such as AM3, AM4, AM5, AM6 and any such additional auxiliary moietiesmay further be selected from OH, SH, NH₂, F, Cl, Br, I, COOH, CN, OCN,CNO, NCS or any combination thereof.

Referring now to methods of forming an oligomer functionalized nitrideparticle, FIG. 2 illustrates a nitride particle oligomerfunctionalization process 200. Nitride particle oligomerfunctionalization process 200 may include a first step 210 of providinga surface modified nitride particle formed according to embodimentsdescribed herein and a second step 220 of chemically reacting at leasttwo oligomers with the auxiliary moieties of the aromatic compound inthe surface modified nitride particle. It will be appreciated that themodified nitride particle may be formed according to any embodimentdescribed herein and may further include any components describedherein.

Referring to second step 220, according to certain embodiments, the twooligomers that are chemically reacted with the auxiliary moieties of thearomatic compound may include particular monomer units. For example, thetwo oligomers may include monomer units of silicone/siloxane, phenolicresin, epoxy resin, poly-butadiene, polyimides, polyester resin,polyurethane, poly(methyl methacrylate) (PMMA), Acrylonitrile butadienestyrene (ABS), polylactic acid, polybenzimaidazole, polycarbonate (PC),polyether sulfone (PES), poly ether ether ketone (PEEK), polyetherimide(PEI), polyethylene (PE), polyphenylene oxide (PPO), polyphenylenesulfide (PPS), polypropylene (PP), polystyrene (PS), polyvinyl chloride(PVC) or poly(dimethylsiloxane). According to still other embodiments,the two oligomers may include monomer units of a fluoropolymer. Forexample, the two oligomers may include monomer units of PTFE, ETFE orPFA.

According to still other embodiments, the two oligomers that arechemically reacted with the auxiliary moieties of the aromatic compoundmay be particular oligomers. For example, the two oligomers may besilicone/siloxane, phenolic resin, epoxy resin, poly-butadiene,polyimides, polyester resin, polyurethane, poly(methyl methacrylate)(PMMA), Acrylonitrile butadiene styrene (ABS), polylactic acid,polybenzimaidazole, polycarbonate (PC), polyether sulfone (PES), polyether ether ketone (PEEK), polyetherimide (PEI), polyethylene (PE),polyphenylene oxide (PPO), polyphenylene sulfide (PPS), polypropylene(PP), polystyrene (PS), polyvinyl chloride (PVC) orpoly(dimethylsiloxane). According to still other embodiments, the twooligomers may be fluoropolymers. For example, the two oligomers may bePTFE, ETFE or PFA.

According to certain embodiments, nitride particle oligomerfunctionalization process 200 may be described according to thefollowing reaction scheme:

where NP represents the nitride particle, AR represents the aromaticcompound, L represents the urethane linkage between the nitride particleand the aromatic compound, OG1 represents a first oligomer, AL1represents the first auxiliary linkage between the AR and OG1, OG2represents a second oligomer and AL2 represents a second auxiliarylinkage between AR and OG2.

According to particular embodiments, NP may be any nitride particlesuitable for surface modification according to embodiments describedherein. According to certain embodiments, the NP may be a crystallinenitride particle or a partially crystalline nitride particle. Accordingto still other embodiments, the NP may be a boron nitride particle or asilicon nitride particle. According to still other embodiments, the NPmay be a cubic boron nitride particle. According to yet otherembodiments, the NP may be a hexagonal boron nitride particle.

According to other embodiments, the AR may include a particular numberof aromatic rings. For example, AR may include at least one aromaticring, such as, at least two aromatic rings or even at least threearomatic rings.

According to still other embodiments, the AR may include multipleisocyanate moieties. For example, the aromatic compound may include atleast two isocyanate moieties, such as, at least three isocyanatemoieties, at least four isocyanate moieties, five isocyanate moieties.

According to yet another embodiment, the AR may include di-isocyanate.According to still another embodiment, the AR may includetri-isocyanate. According to another embodiment, the AR may include4-isocyanate. According to yet another embodiment, the AR may include5-isocyanate. According to yet another embodiment, the AR may include6-isocyanate.

According to yet another embodiment, the AR may include any aromaticcompound as illustrated here:

According to still other embodiments, the AM1 and AM2 may be the sameauxiliary moieties. According to still other embodiments, the AM1 andAM2 may be different auxiliary moieties. According to yet otherembodiments, AM1 and AM2 may be selected from OH, SH, NH₂, F, Cl, Br, I,COOH, CN, OCN, CNO, NCS or any combination thereof.

According to still other embodiments, OG1 and OG2 may include particularmonomer units. For example, the OG1 and OG2 may include monomer units ofsilicone/siloxane, phenolic resin, epoxy resin, poly-butadiene,polyimides, polyester resin, polyurethane, poly(methyl methacrylate)(PMMA), Acrylonitrile butadiene styrene (ABS), polylactic acid,polybenzimaidazole, polycarbonate (PC), polyether sulfone (PES), polyether ether ketone (PEEK), polyetherimide (PEI), polyethylene (PE),polyphenylene oxide (PPO), polyphenylene sulfide (PPS), polypropylene(PP), polystyrene (PS), polyvinyl chloride (PVC) orpoly(dimethylsiloxane). According to still other embodiments, OG1 andOG2 may include monomer units of a fluoropolymer. For example, OG1 andOG2 may include monomer units of PTFE, ETFE or PFA.

According to still other embodiments, OG1 and OG2 may be particularoligomers. For example, OG1 and OG2 may be silicone/siloxane, phenolicresin, epoxy resin, poly-butadiene, polyimides, polyester resin,polyurethane, poly(methyl methacrylate) (PMMA), Acrylonitrile butadienestyrene (ABS), polylactic acid, polybenzimaidazole, polycarbonate (PC),polyether sulfone (PES), poly ether ether ketone (PEEK), polyetherimide(PEI), polyethylene (PE), polyphenylene oxide (PPO), polyphenylenesulfide (PPS), polypropylene (PP), polystyrene (PS), polyvinyl chloride(PVC) or poly(dimethylsiloxane). According to still other embodiments,OG1 and OG2 may be fluoropolymers. For example, OG1 and OG2 may be PTFE,ETFE or PFA.

Referring now to the oligomer functionalized nitride particle formedaccording to embodiments described herein, the oligomer functionalizednitride particle may include a nitride particle, an aromatic compoundcovalently bonded via a urethane moiety to the nitride particle, and atleast two oligomers covalently bonded to the aromatic compound throughat least two auxiliary moieties of the aromatic compound.

According to certain embodiments, the nitride particle of the oligomerfunctionalized nitride particle may be any nitride particle suitable fornitride particle oligomer functionalization according to embodimentsdescribed herein. According to certain embodiments, the nitride particlemay be a crystalline nitride particle or a partially crystalline nitrideparticle. According to still other embodiments, the nitride particle maybe a boron nitride particle or a silicon nitride particle. According tostill other embodiments, the boron nitride particle may be a cubic boronnitride particle. According to yet other embodiments, the boron nitrideparticle may be a hexagonal boron nitride particle.

According to other embodiments, the aromatic compound of the oligomerfunctionalized nitride particle may include a particular number ofaromatic rings. For example, the aromatic compound may include at leastone aromatic ring, such as, at least two aromatic rings or even at leastthree aromatic rings.

According to still other embodiments, the aromatic compound of theoligomer functionalized nitride particle may include multiple isocyanatemoieties. For example, the aromatic compound may include at least twoisocyanate moieties, such as, at least three isocyanate moieties, atleast four isocyanate moieties, five isocyanate moieties.

According to yet another embodiment, the aromatic compound of theoligomer functionalized nitride particle may include di-isocyanate.According to still another embodiment, the aromatic compound of theoligomer functionalized nitride particle may include tri-isocyanate.According to another embodiment, the aromatic compound of the oligomerfunctionalized nitride particle may include 4-isocyanate. According toyet another embodiment, the aromatic compound of the oligomerfunctionalized nitride particle may include 5-isocyanate. According toyet another embodiment, the aromatic compound of the oligomerfunctionalized nitride particle may include 6-isocyanate.

According to yet other embodiments, the aromatic compound of theoligomer functionalized nitride particle may include multiple auxiliarymoieties. It will be appreciated that an auxiliary moiety may be definedas a moiety bonded to the aromatic compound but not to the nitrideparticle. According to particular embodiments, the aromatic compound mayinclude at least two auxiliary moieties, such as, at east threeauxiliary moieties, at least four auxiliary moieties or even at leastfive auxiliary moieties.

According to still other embodiments, the aromatic compound of theoligomer functionalized nitride particle may include particularauxiliary moieties. For example, the aromatic compound of the oligomerfunctionalized nitride particle may include a phenyl moiety, a biphenylmoiety, a naphthyl moiety, a phenanthryl moiety, a methylene-diphenylmoiety, a triphenyl-methane moiety or any combination thereof.

According to still other embodiments, the at least two oligomers of theoligomer functionalized nitride particle may include particular monomerunits. For example, the at least two oligomers may include monomer unitsof silicone/siloxane, phenolic resin, epoxy resin, poly-butadiene,polyimides, polyester resin, polyurethane, poly(methyl methacrylate)(PMMA), Acrylonitrile butadiene styrene (ABS), polylactic acid,polybenzimaidazole, polycarbonate (PC), polyether sulfone (PES), polyether ether ketone (PEEK), polyetherimide (PEI), polyethylene (PE),polyphenylene oxide (PPO), polyphenylene sulfide (PPS), polypropylene(PP), polystyrene (PS), polyvinyl chloride (PVC) orpoly(dimethylsiloxane). According to still other embodiments, the atleast two oligomers may include monomer units of a fluoropolymer. Forexample, the at least two oligomers may include monomer units of PTFE,ETFE or PFA.

According to still other embodiments, the at least two oligomers of theoligomer functionalized nitride particle may be particular oligomers.For example, the at least two oligomers may be silicone/siloxane,phenolic resin, epoxy resin, poly-butadiene, polyimides, polyesterresin, polyurethane, poly(methyl methacrylate) (PMMA), Acrylonitrilebutadiene styrene (ABS), polylactic acid, polybenzimaidazole,polycarbonate (PC), polyether sulfone (PES), poly ether ether ketone(PEEK), polyetherimide (PEI), polyethylene (PE), polyphenylene oxide(PPO), polyphenylene sulfide (PPS), polypropylene (PP), polystyrene(PS), polyvinyl chloride (PVC) or poly(dimethylsiloxane). According tostill other embodiments, the at least two oligomers may befluoropolymers. For example, the at least two oligomers may be PTFE,ETFE or PFA.

According to certain embodiments, the oligomer functionalized nitrideparticle formed according to embodiments described herein may bedescribed as a compound having the following formula:

where NP represents the nitride particle, AR represents the aromaticcompound, L represents the urethane linkage between the nitride particleand the aromatic compound, OG1 represents a first oligomer, AL1represents the first auxiliary linkage between the AR and OG1, OG2represents a second oligomer and AL2 represents a second auxiliarylinkage between AR and OG2.

According to particular embodiments, NP may be any nitride particlesuitable for surface modification according to embodiments describedherein. According to certain embodiments, the NP may be a crystallinenitride particle or a partially crystalline nitride particle. Accordingto still other embodiments, the NP may be a boron nitride particle or asilicon nitride particle. According to still other embodiments, the NPmay be a cubic boron nitride particle. According to yet otherembodiments, the NP may be a hexagonal boron nitride particle.

According to other embodiments, the AR may include a particular numberof aromatic rings. For example, AR may include at least one aromaticring, such as, at least two aromatic rings or even at least threearomatic rings.

According to still other embodiments, the AR may include multipleisocyanate moieties. For example, the aromatic compound may include atleast two isocyanate moieties, such as, at least three isocyanatemoieties, at least four isocyanate moieties, five isocyanate moieties.

According to yet another embodiment, the AR may include di-isocyanate.According to still another embodiment, the AR may includetri-isocyanate. According to another embodiment, the AR may include4-isocyanate. According to yet another embodiment, the AR may include5-isocyanate. According to yet another embodiment, the AR may include6-isocyanate.

According to yet another embodiment, the AR may include any aromaticcompound as illustrated here:

According to still other embodiments, the AL1 and AL2 may be the sameauxiliary moieties. According to still other embodiments, the AL1 andAL2 may be different auxiliary moieties. According to yet otherembodiments, AL1 and AL2 may be selected from OH, SH, NH₂, F, Cl, Br, I,COOH, CN, OCN, CNO, NCS or any combination thereof.

According to still other embodiments, OG1 and OG2 may include particularmonomer units. For example, the OG1 and OG2 may include monomer units ofsilicone/siloxane, phenolic resin, epoxy resin, poly-butadiene,polyimides, polyester resin, polyurethane, poly(methyl methacrylate)(PMMA), Acrylonitrile butadiene styrene (ABS), polylactic acid,polybenzimaidazole, polycarbonate (PC), polyether sulfone (PES), polyether ether ketone (PEEK), polyetherimide (PEI), polyethylene (PE),polyphenylene oxide (PPO), polyphenylene sulfide (PPS), polypropylene(PP), polystyrene (PS), polyvinyl chloride (PVC) orpoly(dimethylsiloxane). According to still other embodiments, OG1 andOG2 may include monomer units of a fluoropolymer. For example, OG1 andOG2 may include monomer units of PTFE, ETFE or PFA.

According to still other embodiments, OG1 and OG2 may be particularoligomers. For example, OG1 and OG2 may be silicone/siloxane, phenolicresin, epoxy resin, poly-butadiene, polyimides, polyester resin,polyurethane, poly(methyl methacrylate) (PMMA), Acrylonitrile butadienestyrene (ABS), polylactic acid, polybenzimaidazole, polycarbonate (PC),polyether sulfone (PES), poly ether ether ketone (PEEK), polyetherimide(PEI), polyethylene (PE), polyphenylene oxide (PPO), polyphenylenesulfide (PPS), polypropylene (PP), polystyrene (PS), polyvinyl chloride(PVC) or poly(dimethylsiloxane). According to still other embodiments,OG1 and OG2 may be fluoropolymers. For example, OG1 and OG2 may be PTFE,ETFE or PFA.

Referring now to methods of forming a polymer based composite includingoligomer functionalized nitride particles, FIG. 3 illustrates a polymerbased composite forming process 300. Polymer based composite formingprocess 300 may include a first step 310 of providing at least onepolymer component and a second step 320 of combining the polymercomponent with a modified nitride filler material that includes oligomerfunctionalized nitride particles. It will be appreciated that theoligomer functionalized nitride particles may be formed according to anyembodiment described herein and may further include any componentsdescribed herein.

Referring to first step 310, according to certain embodiments, thepolymer component may include particular monomer units. For example, thepolymer component may include monomer units of silicone/siloxane,phenolic resin, epoxy resin, poly-butadiene, polyimides, polyesterresin, polyurethane, poly(methyl methacrylate) (PMMA), Acrylonitrilebutadiene styrene (ABS), polylactic acid, polybenzimaidazole,polycarbonate (PC), polyether sulfone (PES), poly ether ether ketone(PEEK), polyetherimide (PEI), polyethylene (PE), polyphenylene oxide(PPO), polyphenylene sulfide (PPS), polypropylene (PP), polystyrene(PS), polyvinyl chloride (PVC) or poly(dimethylsiloxane). According tostill other embodiments, the polymer component may include monomer unitsof a fluoropolymer. For example, the polymer component may includemonomer units of PTFE, ETFE or PFA.

According to still other embodiments, the polymer component may beparticular oligomers. For example, the polymer component may besilicone/siloxane, phenolic resin, epoxy resin, poly-butadiene,polyimides, polyester resin, polyurethane, poly(methyl methacrylate)(PMMA), Acrylonitrile butadiene styrene (ABS), polylactic acid,polybenzimaidazole, polycarbonate (PC), polyether sulfone (PES), polyether ether ketone (PEEK), polyetherimide (PEI), polyethylene (PE),polyphenylene oxide (PPO), polyphenylene sulfide (PPS), polypropylene(PP), polystyrene (PS), polyvinyl chloride (PVC) orpoly(dimethylsiloxane). According to still other embodiments, thepolymer component may be fluoropolymers. For example, the polymercomponent may be PTFE, ETFE or PFA.

According to yet other embodiments, a monomer unit of the polymercomponent may be from the same organic component family as a monomerunit of the oligomer components. According to still other embodiments, amonomer unit of the polymer component may be the same as a monomer unitof the oligomer components.

Referring now to the polymer based composite formed according toembodiments described herein, the polymer based composite may include atleast one polymer component and a modified nitride filler materialdispersed within the polymer component. The modified nitride fillermaterial may include oligomer functionalized nitride particles. Theoligomer functionalized nitride particles may include a nitrideparticle, an aromatic compound covalently bonded via a urethane moietyto the nitride particle, and at least two oligomers covalently bonded tothe aromatic compound through at least two auxiliary moieties of thearomatic compound.

According to certain embodiments, the nitride particle of the oligomerfunctionalized nitride particle in the polymer based composite may beany nitride particle suitable for nitride particle oligomerfunctionalization according to embodiments described herein. Accordingto certain embodiments, the nitride particle may be a crystallinenitride particle or a partially crystalline nitride particle. Accordingto still other embodiments, the nitride particle may be a boron nitrideparticle or a silicon nitride particle. According to still otherembodiments, the boron nitride particle may be a cubic boron nitrideparticle. According to yet other embodiments, the boron nitride particlemay be a hexagonal boron nitride particle.

According to other embodiments, the aromatic compound of the oligomerfunctionalized nitride particle in the polymer based composite mayinclude a particular number of aromatic rings. For example, the aromaticcompound may include at least one aromatic ring, such as, at least twoaromatic rings or even at least three aromatic rings.

According to still other embodiments, the aromatic compound of theoligomer functionalized nitride particle in the polymer based compositemay include multiple isocyanate moieties. For example, the aromaticcompound may include at least two isocyanate moieties, such as, at leastthree isocyanate moieties, at least four isocyanate moieties, fiveisocyanate moieties.

According to yet another embodiment, the aromatic compound of theoligomer functionalized nitride particle in the polymer based compositemay include di-isocyanate. According to still another embodiment, thearomatic compound of the oligomer functionalized nitride particle mayinclude tri-isocyanate. According to another embodiment, the aromaticcompound of the oligomer functionalized nitride particle may include4-isocyanate. According to yet another embodiment, the aromatic compoundof the oligomer functionalized nitride particle may include5-isocyanate. According to yet another embodiment, the aromatic compoundof the oligomer functionalized nitride particle may include6-isocyanate.

According to yet other embodiments, the aromatic compound of theoligomer functionalized nitride particle in the polymer based compositemay include multiple auxiliary moieties. It will be appreciated that anauxiliary moiety may be defined as a moiety bonded to the aromaticcompound but not to the nitride particle. According to particularembodiments, the aromatic compound may include at least two auxiliarymoieties, such as, at east three auxiliary moieties, at least fourauxiliary moieties or even at least five auxiliary moieties.

According to still other embodiments, the aromatic compound of theoligomer functionalized nitride particle in the polymer based compositemay include particular auxiliary moieties. For example, the aromaticcompound of the oligomer functionalized nitride particle may include aphenyl moiety, a biphenyl moiety, a naphthyl moiety, a phenanthrylmoiety, a methylene-diphenyl moiety, a triphenyl-methane moiety or anycombination thereof.

According to still other embodiments, the at least two oligomers of theoligomer functionalized nitride particle in the polymer based compositemay include particular monomer units. For example, the at least twooligomers may include monomer units of silicone/siloxane, phenolicresin, epoxy resin, poly-butadiene, polyimides, polyester resin,polyurethane, poly(methyl methacrylate) (PMMA), Acrylonitrile butadienestyrene (ABS), polylactic acid, polybenzimaidazole, polycarbonate (PC),polyether sulfone (PES), poly ether ether ketone (PEEK), polyetherimide(PEI), polyethylene (PE), polyphenylene oxide (PPO), polyphenylenesulfide (PPS), polypropylene (PP), polystyrene (PS), polyvinyl chloride(PVC) or poly(dimethylsiloxane). According to still other embodiments,the at least two oligomers may include monomer units of a fluoropolymer.For example, the at least two oligomers may include monomer units ofPTFE, ETFE or PFA.

According to still other embodiments, the at least two oligomers of theoligomer functionalized nitride particle in the polymer based compositemay be particular oligomers. For example, the at least two oligomers maybe silicone/siloxane, phenolic resin, epoxy resin, poly-butadiene,polyimides, polyester resin, polyurethane, poly(methyl methacrylate)(PMMA), Acrylonitrile butadiene styrene (ABS), polylactic acid,polybenzimaidazole, polycarbonate (PC), polyether sulfone (PES), polyether ether ketone (PEEK), polyetherimide (PEI), polyethylene (PE),polyphenylene oxide (PPO), polyphenylene sulfide (PPS), polypropylene(PP), polystyrene (PS), polyvinyl chloride (PVC) orpoly(dimethylsiloxane). According to still other embodiments, the atleast two oligomers may be fluoropolymers. For example, the at least twooligomers may be PTFE, ETFE or PFA.

According to yet other embodiments, the polymer component in the polymerbased composite may include particular monomer units. For example, thepolymer component may include monomer units of silicone/siloxane,phenolic resin, epoxy resin, poly-butadiene, polyimides, polyesterresin, polyurethane, poly(methyl methacrylate) (PMMA), Acrylonitrilebutadiene styrene (ABS), polylactic acid, polybenzimaidazole,polycarbonate (PC), polyether sulfone (PES), poly ether ether ketone(PEEK), polyetherimide (PEI), polyethylene (PE), polyphenylene oxide(PPO), polyphenylene sulfide (PPS), polypropylene (PP), polystyrene(PS), polyvinyl chloride (PVC) or poly(dimethylsiloxane). According tostill other embodiments, the polymer component may include monomer unitsof a fluoropolymer. For example, the polymer component may includemonomer units of PTFE, ETFE or PFA.

According to still other embodiments, the polymer component in thepolymer based composite may be particular oligomers. For example, thepolymer component may be silicone/siloxane, phenolic resin, epoxy resin,poly-butadiene, polyimides, polyester resin, polyurethane, poly(methylmethacrylate) (PMMA), Acrylonitrile butadiene styrene (ABS), polylacticacid, polybenzimaidazole, polycarbonate (PC), polyether sulfone (PES),poly ether ether ketone (PEEK), polyetherimide (PEI), polyethylene (PE),polyphenylene oxide (PPO), polyphenylene sulfide (PPS), polypropylene(PP), polystyrene (PS), polyvinyl chloride (PVC) orpoly(dimethylsiloxane). According to still other embodiments, thepolymer component may be fluoropolymers. For example, the polymercomponent may be PTFE, ETFE or PFA.

According to yet other embodiments, a monomer unit of the polymercomponent in the polymer based composite may be from the same organiccomponent family as a monomer unit of the oligomer components in thepolymer based composite. According to still other embodiments, a monomerunit of the polymer component in the polymer based composite may be thesame as a monomer unit of the oligomer components in the polymer basedcomposite.

According to still other embodiments, a polymer based composite formedaccording to embodiments described herein may have a particular peelstrength as measured according to IPC standard 2.4.9. For example, apolymer based composite formed according to embodiments described hereinmay have a peel strength of at least about 5 N/in, such as, at leastabout 18 N/in or even at least about 20 N/in. According to still otherembodiments, a polymer based composite formed according to embodimentsdescribed herein may have a peel strength of not greater than about 100N/in, such as, not greater than about 75 N/in or even not greater thanabout 50 N/in. It will be appreciated that the peel strength of apolymer based composite formed according to embodiments described hereinmay be any value between any of minimum and maximum values noted above.It will be further appreciated that the peel strength of a polymer basedcomposite formed according to embodiments described may be within arange between any of the minimum and maximum values noted above.

According to yet other embodiments, a polymer based composite formedaccording to embodiments described herein may have a particular originalpeel strength percentage equal to CPL/PPL*100, where CPL is equal to thepeel strength of the polymer based composite and PPL is equal to thepeel strength of the polymer component alone that is used to form thepolymer based composite. It will be appreciated that peel strength ismeasured according to IPC standard 2.4.9. According to particularembodiments, a polymer based composite formed according to embodimentsdescribed herein may have an original peel strength percentage of atleast about 60%, such as, at least about 70%, at least about 75%, atleast about 80%, at least about 90%, at least about 95%, at least about100%, at least about 105%, at least about 110%, at least about 120%, atleast about 125%, at least about 130%, at least about 135%, at leastabout 140%, at least about 150%, at least about 175% or even at leastabout 200%. According to still other embodiments, a polymer basedcomposite formed according to embodiments described herein may have anoriginal peel strength percentage of not greater than about 250%. Itwill be appreciated that the original peel strength percentage of apolymer based composite formed according to embodiments described hereinmay be any value between any of minimum and maximum values noted above.It will be further appreciated that the original peel strengthpercentage of a polymer based composite formed according to embodimentsdescribed may be within a range between any of the minimum and maximumvalues noted above. According to still other embodiments, a polymerbased composite formed according to embodiments described herein mayhave a particular thermal conductivity. Thermal conductivity iscalculated as the product of thermal diffusivity, density and heatcapacity. More particularly, through plane thermal conductivity iscalculated as the product of the through plane thermal diffusivity, thedensity and the heat capacity. The thermal diffusivity of the compositepolymer is measured according to the standard ASTM C-518 by the thermalflows method. The diffusivity is measured perpendicularly to thecomposite polymer layer. The heat capacity of the composite polymer ismeasured by DSC (differential scanning calorimetry) on a Netzschthermobalance. The composite polymer density is measured by Heliumpycnometry.

According to certain embodiments, a polymer based composite formedaccording to embodiments described herein may have a thermalconductivity of at least about 0.2 W/mK, such as, at least about 0.5W/mK, at least about 1 W/mK, at least about 2 W/mK, at least about 3W/mK, at least about 5 W/mK, at least about 7 W/mK, or even at leastabout 10 W/mK. According to still other embodiments, a polymer basedcomposite formed according to embodiments described herein may have athermal conductivity of not greater than about 20 W/mK, such as, notgreater than about 15 W/mK. It will be appreciated that the thermalconductivity of a polymer based composite formed according toembodiments described herein may be any value between any of minimum andmaximum values noted above. It will be further appreciated that thethermal conductivity of a polymer based composite formed according toembodiments described may be within a range between any of the minimumand maximum values noted above.

According to yet other embodiments, a polymer based composite formedaccording to embodiments described herein may have a particular originalthermal conductivity percentage equal to CTC/PTC*100, where CTC is equalto the thermal conductivity of the polymer based composite and PTC isequal to the thermal conductivity of the polymer component alone that isused to form the polymer based composite. It will be appreciated thatthermal conductivity of both the composite are measured according to thestandard outlined above. According to particular embodiments, a polymerbased composite formed according to embodiments described herein mayhave an original thermal conductivity percentage of at least about 200%,such as, at least about 300%, at least about 400%, at least about 500%,at least about 1000%, at least about 2000%, at least about 5000%, oreven at least about 10000%. According to still other embodiments, apolymer based composite formed according to embodiments described hereinmay have an original thermal conductivity percentage of not greater thanabout 20000%. It will be appreciated that the original thermalconductivity percentage of a polymer based composite formed according toembodiments described herein may be any value between any of minimum andmaximum values noted above. It will be further appreciated that theoriginal thermal conductivity percentage of a polymer based compositeformed according to embodiments described may be within a range betweenany of the minimum and maximum values noted above.

Many different aspects and embodiments are possible. Some of thoseaspects and embodiments are described herein. After reading thisspecification, skilled artisans will appreciate that those aspects andembodiments are only illustrative and do not limit the scope of thepresent invention. Embodiments may be in accordance with any one or moreof the embodiments as listed below.

Embodiment 1

A surface modified nitride particle comprising: a nitride particlecovalently bonded via a urethane moiety to an aromatic compound; and atleast two auxiliary moieties.

Embodiment 2

A method of forming a modified nitride particle, wherein the methodcomprises: activating a nitride particle to form at least one hydroxylgroup; chemically reacting an aromatic compound with the at least onehydroxyl group on the nitride particle, wherein the aromatic compoundcomprises at least two auxiliary moieties.

Embodiment 3

The surface modified nitride particle or method of any one ofembodiments 1 and 2, wherein the nitride particle is a boron nitrideparticle or a silicon nitride particle.

Embodiment 4

The surface modified nitride particle or method of any one ofembodiments 1 and 2, wherein the nitride particle is a hexagonal boronnitride particle.

Embodiment 5

The surface modified nitride particle or method of any one ofembodiments 1 and 2, wherein a majority of any moieties connecting thenitride particle and the aromatic compound are urethane moieties.

Embodiment 6

The surface modified nitride particle or method of any one ofembodiments 1 and 2, wherein the aromatic compound comprises at leastone aromatic ring, at least two aromatic rings, at least three aromaticrings.

Embodiment 7

The surface modified nitride particle or method of any one ofembodiments 1 and 2, wherein the aromatic compound comprises a phenylmoiety, a biphenyl moiety, a naphthyl moiety, a phenanthryl moiety, amethylene-diphenyl moiety, a triphenyl-methane moiety.

Embodiment 8

The surface modified nitride particle or method of any one ofembodiments 1 and 2, wherein the at least two auxiliary moieties areamino groups (—NH2), hydroxyl groups (—OH), fluoro groups (—F), chlorogroups (—Cl), bromo groups (—Br), iodo groups (—I), carboxyl groups(—COOH), cyano groups (—CN), cyanate groups (—OCN), isocyanate groups(—NCO), thiol groups (—SH), or thioisocyanate groups (—NCS).

Embodiment 9

The surface modified nitride particle or method of any one ofembodiments 1 and 2, wherein the aromatic compound comprises twoisocyanate moieties, three isocyanate moieties, four isocyanatemoieties, five isocyanate moieties.

Embodiment 10

An oligomer functionalized nitride particle comprising: a nitrideparticle; an aromatic compound covalently bonded via a urethane moietyto the nitride particle; and at least two oligomers covalently bonded tothe aromatic compound via at least two auxiliary moieties of thearomatic compound.

Embodiment 11

A method of forming an oligomer functionalized nitride particle, whereinthe method comprises: activating a nitride particle to form at least onehydroxyl group; chemically reacting an aromatic compound with the atleast one hydroxyl group on the nitride particle, wherein the aromaticcompound comprises at least two auxiliary moieties; and chemicallyreacting at least two oligomers covalently bonded to the aromaticcompound via the at least two auxiliary moieties.

Embodiment 12

The oligomer functionalized nitride particle or method of any one ofembodiments 10 and 11, wherein the nitride particle is a boron nitrideparticle or a silicon nitride particle.

Embodiment 13

The oligomer functionalized nitride particle or method of any one ofembodiments 10 and 11, wherein the nitride particle is a hexagonal boronnitride particle.

Embodiment 14

The oligomer functionalized nitride particle or method of any one ofembodiments 10 and 11, wherein a majority of any moieties connecting thenitride particle and the aromatic compound are urethane moieties.

Embodiment 15

The oligomer functionalized nitride particle or method of any one ofembodiments 10 and 11, wherein the aromatic compound comprises at leastone aromatic ring, at least two aromatic rings, at least three aromaticrings.

Embodiment 16

The oligomer functionalized nitride particle or method of any one ofembodiments 10 and 11, wherein the aromatic compound comprises a phenylmoiety, a biphenyl moiety, a naphthyl moiety, a phenanthryl moiety, amethylene-diphenyl moiety, a triphenyl-methane moiety.

Embodiment 17

The oligomer functionalized nitride particle or method of any one ofembodiments 10 and 11, wherein the at least two auxiliary moieties areamino groups (—NH2), hydroxyl groups (—OH), fluoro groups (—F), chlorogroups (—Cl), bromo groups (—Br), iodo groups (—I), carboxyl groups(—COOH), cyano groups (—CN), cyanate groups (—OCN), isocyanate groups(—NCO), thiol groups (—SH), or thioisocyanate groups (—NCS).

Embodiment 18

The oligomer functionalized nitride particle or method of any one ofembodiments 10 and 11, wherein the aromatic compound comprises twoisocyanate moieties, three isocyanate moieties, four isocyanatemoieties, five isocyanate moieties.

Embodiment 19

The oligomer functionalized nitride particle or method of any one ofembodiments 10 and 11, wherein the oligomer components comprisessilicone/siloxane, phenolic resin, epoxy resin, poly-butadiene,polyimides, polyester resin, polyurethane, poly(methyl methacrylate)(PMMA), Acrylonitrile butadiene styrene (ABS), polylactic acid,polybenzimaidazole (PBO and PBI), polycarbonate (PC), polyether sulfone(PES), poly ether ether ketone (PEEK), polyetherimide (PEI),polyethylene (PE), polyphenylene oxide (PPO), polyphenylene sulfide(PPS), polyether sulfone (PES), polysulfone (PS), polypropylene (PP),polystyrene (PS), polyvinyl chloride (PVC), poly(dimethylsiloxane) or afluoropolymer.

Embodiment 20

The oligomer functionalized nitride particle or method of embodiment 19,wherein the fluoro-based oligomers comprises of PTFE, ETFE, FEP, ECTFEor PFA.

Embodiment 21

A polymer based composite comprising: at least one polymer component anda modified nitride filler material dispersed within the polymercomponent, wherein the modified nitride filler material comprises: anitride particle; an aromatic compound covalently bonded via a urethanelinkage to the nitride particle; and at least two oligomer componentscovalently bonded to the aromatic compound.

Embodiment 22

A method of forming a polymer based composite, wherein the methodcomprises: combining at least one polymer component with a nitridefiller material of oligomer functionalized nitride particles, whereineach of the oligomer functionalized nitride particles comprise: anitride particle; an aromatic compound covalently bonded via a urethanelinkage to the nitride particle; and at least two oligomer componentscovalently bonded to the aromatic compound.

Embodiment 23

The polymer composite or method of any one of embodiments 21 and 22,wherein the nitride particle is a boron nitride particle or a siliconnitride particle.

Embodiment 24

The polymer composite or method of any one of embodiments 21 and 22,wherein the nitride particle is a hexagonal boron nitride particle.

Embodiment 25

The oligomer functionalized nitride particle or method of any one ofembodiments 21 and 22, wherein a majority of any moieties connecting thenitride particle and the aromatic compound are urethane moieties.

Embodiment 26

The polymer composite or method of any one of embodiments 21 and 22,wherein the aromatic compound comprises at least one aromatic ring, atleast two aromatic rings, at least three aromatic rings.

Embodiment 27

The polymer composite or method of any one of embodiments 21 and 22,wherein the aromatic compound comprises a phenyl moiety, a biphenylmoiety, a naphthyl moiety, a phenanthryl moiety, a methylene-diphenylmoiety, a triphenyl-methane moiety.

Embodiment 28

The oligomer functionalized nitride particle or method of any one ofembodiments 21 and 22, wherein the at least two auxiliary moieties areamino groups (—NH2), hydroxyl groups (—OH), fluoro groups (—F), chlorogroups (—Cl), bromo groups (—Br), iodo groups (—I), carboxyl groups(—COOH), cyano groups (—CN), cyanate groups (—OCN), isocyanate groups(—NCO), thiol groups (—SH), or thioisocyanate groups (—NCS).

Embodiment 29

The polymer composite or method of any one of embodiments 21 and 22,wherein the aromatic compound comprises two isocyanate moieties, threeisocyanate moieties, four isocyanate moieties, five isocyanate moieties.

Embodiment 30

The polymer composite or method of any one of embodiments 21 and 22,wherein the polymer component comprises silicone/siloxane, phenolicresin, epoxy resin, poly-butadiene, polyimides, polyester resin,polyurethane, poly(methyl methacrylate) (PMMA), Acrylonitrile butadienestyrene (ABS), polylactic acid, polybenzimaidazole (PBO and PBI),polycarbonate (PC), polyether sulfone (PES), poly ether ether ketone(PEEK), polyetherimide (PEI), polyethylene (PE), polyphenylene oxide(PPO), polyphenylene sulfide (PPS), polysulfone, polypropylene (PP),polystyrene (PS), polyvinyl chloride (PVC), poly(dimethylsiloxane) or afluoropolymer.

Embodiment 31

The polymer composite or method of embodiment 30, wherein thefluoro-based polymer comprises PTFE, ETFE, FEP, ECTFE or PFA.

Embodiment 32

The polymer based composite or method of any one of embodiments 21 and22, wherein a monomer unit of the polymer component is from the samefamily as a monomer unit of the oligomer components.

Embodiment 33

The polymer based composite or method of embodiment 32, wherein amonomer unit of the polymer component is the same as a monomer unit ofthe oligomer components.

Embodiment 34

The polymer composite or method of any one of embodiments 21 and 22,wherein the polymer component comprises a thermoset polymer or athermoplastic polymer.

Embodiment 35

The polymer based composite or method of embodiment 34, wherein thepolymer component comprises silicone/siloxane, phenolic resin, epoxyresin, poly-butadiene, polyimides, polyester resin, polyurethane,poly(methyl methacrylate) (PMMA), Acrylonitrile butadiene styrene (ABS),polylactic acid, polybenzimaidazole (PBO and PBI), polycarbonate (PC),polyether sulfone (PES), poly ether ether ketone (PEEK), polyetherimide(PEI), polyethylene (PE), polyphenylene oxide (PPO), polyphenylenesulfide (PPS), polysulfone, polypropylene (PP), polystyrene (PS),polyvinyl chloride (PVC), poly(dimethylsiloxane) or a fluoropolymer.

Embodiment 36

The polymer composite or method of any one of embodiments 21 and 22,wherein the polymer component comprises phenol formaldehyde resins,Bakelite, Novotext (cotton fibre-reinforced phenolic), Oasis (anopen-celled phenolic foam), Maritex Aquarius, poly-butadiene,styrene-butadiene copolymer,Kapton(poly-oxydiphenylene-pyromellitimide), aliphatic polyimides,aromatic polyimides, semiaromatic polyimides, Acrylatedsaturated/unsaturated aliphatic polyurethane, Polybutadiene rubberblended with nitrile rubber, styrene-butadiene copolymer or UTEM.

Embodiment 37

The polymer composite or method of any one of embodiments 21 and 22,wherein the fluoro-based polymer comprises PTFE, ETFE, FEP, ECTFE orPFA.

Embodiment 38

The polymer composite or method of any one of embodiments 21 and 22,wherein the oligomer components comprises silicone/siloxane, phenolicresin, epoxy resin, poly-butadiene, polyimides, polyester resin,polyurethane, poly(methyl methacrylate) (PMMA), Acrylonitrile butadienestyrene (ABS), polylactic acid, polybenzimaidazole (PBO and PBI),polycarbonate (PC), polyether sulfone (PES), poly ether ether ketone(PEEK), polyetherimide (PEI), polyethylene (PE), polyphenylene oxide(PPO), polyphenylene sulfide (PPS), polysulfone, polypropylene (PP),polystyrene (PS), polyvinyl chloride (PVC), poly(dimethylsiloxane) or afluoropolymer.

Embodiment 39

The polymer based composite of embodiment 38, wherein the fluoro-basedoligomers comprises of PTFE, ETFE or PFA.

Embodiment 40

The polymer composite or method of any one of embodiments 21 and 22,wherein the polymer based composite comprises a peel strength of atleast about 10 N/in and a thermal conductivity of at least about 0.2W/mK.

Embodiment 41

The polymer composite or method of any one of embodiments 21 and 22,wherein the polymer based composite comprises a peel strength of atleast about 5 N/in.

Embodiment 42

The polymer composite or method of any one of embodiments 21 and 22,wherein the polymer based composite comprises a thermal conductivity ofat least about 1 W/mK.

Embodiment 43

A surface modified boron nitride particle comprising: a boron nitrideparticle covalently bonded via a urethane moiety to an aromaticcompound; and at least two auxiliary moieties.

Embodiment 44

A method of forming a surface modified boron nitride particle, whereinthe method comprises: activating a boron nitride particle to form atleast one hydroxyl group; chemically reacting an aromatic compound withthe at least one hydroxyl group on the boron nitride particle, whereinthe aromatic compound comprises at least two auxiliary moieties.

Embodiment 45

The surface modified boron nitride particle or method of any one ofembodiments 43 and 44, wherein the boron nitride particle is a hexagonalboron nitride particle.

Embodiment 46

The surface modified boron nitride particle or method of any one ofembodiments 43 and 44, wherein a majority of any moieties connecting theboron nitride particle and the aromatic compound are urethane moieties.

Embodiment 47

The surface modified boron nitride particle or method of any one ofembodiments 43 and 44, wherein the aromatic compound comprises at leastone aromatic ring, at least two aromatic rings, at least three aromaticrings.

Embodiment 48

The surface modified boron nitride particle or method of any one ofembodiments 43 and 44, wherein the aromatic compound comprises a phenylmoiety, a biphenyl moiety, a naphthyl moiety, a phenanthryl moiety, amethylene-diphenyl moiety, a triphenyl-methane moiety.

Embodiment 49

The surface modified boron nitride particle or method of any one ofembodiments 43 and 44, wherein the at least two auxiliary moieties areamino groups (—NH2), hydroxyl groups (—OH), fluoro groups (—F), chlorogroups (—Cl), bromo groups (—Br), iodo groups (—I), carboxyl groups(—COOH), cyano groups (—CN), cyanate groups (—OCN), isocyanate groups(—NCO), thiol groups (—SH), or thioisocyanate groups (—NCS).

Embodiment 50

The surface modified boron nitride particle or method of any one ofembodiments 43 and 44, wherein the aromatic compound comprises twoisocyanate moieties, three isocyanate moieties, four isocyanatemoieties, five isocyanate moieties.

Embodiment 51

An oligomer functionalized boron nitride particle comprising: a boronnitride particle; an aromatic compound covalently bonded via a urethanemoiety to the boron nitride particle; and at least two oligomerscovalently bonded to the aromatic compound via at least two auxiliarymoieties of the aromatic compound.

Embodiment 52

A method of forming an oligomer functionalized boron nitride particle,wherein the method comprises: activating a boron nitride particle toform at least one hydroxyl group; chemically reacting an aromaticcompound with the at least one hydroxyl group on the boron nitrideparticle, wherein the aromatic compound comprises at least two auxiliarymoieties; and chemically reacting at least two oligomers covalentlybonded to the aromatic compound via the at least two auxiliary moieties.

Embodiment 53

The oligomer functionalized boron nitride particle or method of any oneof embodiments 51 and 52, wherein the boron nitride particle is ahexagonal boron nitride particle.

Embodiment 54

The oligomer functionalized boron nitride particle or method of any oneof embodiments 51 and 52, wherein a majority of any moieties connectingthe boron nitride particle and the aromatic compound are urethanemoieties.

Embodiment 55

The oligomer functionalized boron nitride particle or method of any oneof embodiments 51 and 52, wherein the aromatic compound comprises atleast one aromatic ring, at least two aromatic rings, at least threearomatic rings.

Embodiment 56

The oligomer functionalized boron nitride particle or method of any oneof embodiments 51 and 52, wherein the aromatic compound comprises aphenyl moiety, a biphenyl moiety, a naphthyl moiety, a phenanthrylmoiety, a methylene-diphenyl moiety, a triphenyl-methane moiety.

Embodiment 57

The oligomer functionalized boron nitride particle or method of any oneof embodiments 51 and 52, wherein the at least two auxiliary moietiesare amino groups (—NH2), hydroxyl groups (—OH), fluoro groups (—F),chloro groups (—Cl), bromo groups (—Br), iodo groups (—I), carboxylgroups (—COOH), cyano groups (—CN), cyanate groups (—OCN), isocyanategroups (—NCO), thiol groups (—SH), or thioisocyanate groups (—NCS).

Embodiment 58

The oligomer functionalized boron nitride particle or method of any oneof embodiments 51 and 52, wherein the aromatic compound comprises twoisocyanate moieties, three isocyanate moieties, four isocyanatemoieties, five isocyanate moieties.

Embodiment 59

The oligomer functionalized boron nitride particle or method of any oneof embodiments 51 and 52, wherein the oligomer components comprisessilicone/siloxane, phenolic resin, epoxy resin, poly-butadiene,polyimides, polyester resin, polyurethane, poly(methyl methacrylate)(PMMA), Acrylonitrile butadiene styrene (ABS), polylactic acid,polybenzimaidazole (PBO and PBI), polycarbonate (PC), polyether sulfone(PES), poly ether ether ketone (PEEK), polyetherimide (PEI),polyethylene (PE), polyphenylene oxide (PPO), polyphenylene sulfide(PPS), polysulfone, polypropylene (PP), polystyrene (PS), polyvinylchloride (PVC), poly(dimethylsiloxane) or a fluoropolymer.

Embodiment 60

The oligomer functionalized boron nitride particle or method ofembodiment 59, wherein the fluoro-based oligomers comprises of PTFE,ETFE, FEP, ECTFE or PFA.

Embodiment 61

A polymer based composite comprising: at least one polymer component anda modified boron nitride filler material dispersed within the polymercomponent, wherein the modified boron nitride filler material comprises:a boron nitride particle; an aromatic compound covalently bonded via aurethane linkage to the boron nitride particle; and at least twooligomer components covalently bonded to the aromatic compound.

Embodiment 62

A method of forming a polymer based composite, wherein the methodcomprises: combining at least one polymer component with a boron nitridefiller material of oligomer functionalized boron nitride particles,wherein each of the oligomer functionalized boron nitride particlescomprise: a boron nitride particle; an aromatic compound covalentlybonded via a urethane linkage to the boron nitride particle; and atleast two oligomer components covalently bonded to the aromaticcompound.

Embodiment 63

The polymer composite or method of any one of embodiments 61 and 62,wherein the boron nitride particle is a hexagonal boron nitrideparticle.

Embodiment 64

The polymer composite or method of any one of embodiments 61 and 62,wherein a majority of any moieties connecting the boron nitride particleand the aromatic compound are urethane moieties.

Embodiment 65

The polymer composite or method of any one of embodiments 61 and 62,wherein the aromatic compound comprises at least one aromatic ring, atleast two aromatic rings, at least three aromatic rings.

Embodiment 66

The polymer composite or method of any one of embodiments 61 and 62,wherein the aromatic compound comprises a phenyl moiety, a biphenylmoiety, a naphthyl moiety, a phenanthryl moiety, a methylene-diphenylmoiety, a triphenyl-methane moiety.

Embodiment 67

The polymer composite or method of any one of embodiments 61 and 62,wherein the at least two auxiliary moieties are amino groups (—NH2),hydroxyl groups (—OH), fluoro groups (—F), chloro groups (—Cl), bromogroups (—Br), iodo groups (—I), carboxyl groups (—COOH), cyano groups(—CN), cyanate groups (—OCN), isocyanate groups (—NCO), thiol groups(—SH), or thioisocyanate groups (—NCS).

Embodiment 68

The polymer composite or method of any one of embodiments 61 and 62,wherein the aromatic compound comprises two isocyanate moieties, threeisocyanate moieties, four isocyanate moieties, five isocyanate moieties.

Embodiment 69

The polymer composite or method of any one of embodiments 61 and 62,wherein the polymer component comprises silicone/siloxane, phenolicresin, epoxy resin, poly-butadiene, polyimides, polyester resin,polyurethane, poly(methyl methacrylate) (PMMA), Acrylonitrile butadienestyrene (ABS), polylactic acid, polybenzimaidazole (PBO and PBI),polycarbonate (PC), polyether sulfone (PES), poly ether ether ketone(PEEK), polyetherimide (PEI), polyethylene (PE), polyphenylene oxide(PPO), polyphenylene sulfide (PPS), polyether sulfone (PES), polysulfone(PS), polypropylene (PP), polystyrene (PS), polyvinyl chloride (PVC),poly(dimethylsiloxane) or a fluoropolymer.

Embodiment 70

The polymer composite or method of embodiment 69, wherein thefluoro-based polymer comprises PTFE, ETFE, FEP, ECTFE or PFA.

Embodiment 71

The polymer composite or method of any one of embodiments 61 and 62,wherein a monomer unit of the polymer component is from the same familyas a monomer unit of the oligomer components.

Embodiment 72

The polymer based composite or method of embodiment 71, wherein amonomer unit of the polymer component is the same as a monomer unit ofthe oligomer components.

Embodiment 73

The polymer composite or method of any one of embodiments 61 and 62,wherein the polymer component comprises a thermoset polymer or athermoplastic polymer.

Embodiment 74

The polymer based composite or method of embodiment 73, wherein thepolymer component comprises silicone/siloxane, phenolic resin, epoxyresin, poly-butadiene, polyimides, polyester resin, polyurethane,poly(methyl methacrylate) (PMMA), Acrylonitrile butadiene styrene (ABS),polylactic acid, polybenzimaidazole (PBO and PBI), polycarbonate (PC),polyether sulfone (PES), poly ether ether ketone (PEEK), polyetherimide(PEI), polyethylene (PE), polyphenylene oxide (PPO), polyphenylenesulfide (PPS), polyether sulfone (PES), polysulfone (PS), polypropylene(PP), polystyrene (PS), polyvinyl chloride (PVC), poly(dimethylsiloxane)or a fluoropolymer.

Embodiment 75

The polymer composite or method of any one of embodiments 61 and 62,wherein the polymer component comprises phenol formaldehyde resins,Bakelite, Novotext (cotton fibre-reinforced phenolic), Oasis (anopen-celled phenolic foam), Maritex Aquarius, poly-butadiene,styrene-butadiene copolymer,Kapton(poly-oxydiphenylene-pyromellitimide), aliphatic polyimides,aromatic polyimides, semiaromatic polyimides, Acrylatedsaturated/unsaturated aliphatic polyurethane, Polybutadiene rubberblended with nitrile rubber, styrene-butadiene copolymer or UTEM.

Embodiment 76

The polymer composite or method of any one of embodiments 61 and 62,wherein the fluoro-based polymer comprises PTFE, ETFE, FEP, ECTFE orPFA.

Embodiment 77

The polymer composite or method of any one of embodiments 61 and 62,wherein the oligomer components comprises silicone/siloxane, phenolicresin, epoxy resin, poly-butadiene, polyimides, polyester resin,polyurethane, poly(methyl methacrylate) (PMMA), Acrylonitrile butadienestyrene (ABS), polylactic acid, polybenzimaidazole, polycarbonate (PC),polyether sulfone (PES), poly ether ether ketone (PEEK), polyetherimide(PEI), polyethylene (PE), polyphenylene oxide (PPO), polyphenylenesulfide (PPS), polypropylene (PP), polystyrene (PS), polyvinyl chloride(PVC), poly(dimethylsiloxane) or a fluoropolymer.

Embodiment 78

The polymer based composite of embodiment 77, wherein the fluoro-basedoligomers comprises of PTFE, ETFE or PFA.

Embodiment 79

The polymer composite or method of any one of embodiments 61 and 62,wherein the polymer based composite comprises a peel strength of atleast about 10 N/in and a thermal conductivity of at least about 0.2W/mK.

Embodiment 80

The polymer composite or method of any one of embodiments 61 and 62,wherein the polymer based composite comprises a peel strength of atleast about 15 N/in, at least about 20N/in.

Embodiment 81

The polymer composite or method of any one of embodiments 61 and 62,wherein the polymer based composite comprises a thermal conductivity ofat least about 1 W/mK.

EXAMPLES Example 1

A sample polymer based composite 51 was formed according to embodimentsdescribed herein. Specifically, 51 included oligomer functionalizedhexagonal boron nitride powder formed according to embodiments describedherein and combined in a polybutadiene polymer matrix with a 10% massratio of nitride powder to polymer matrix.

For purposes of comparison, two comparison sample composites CS1 and CS2were formed. Comparison sample composite CS1 included a polybutadienepolymer matrix with no fillers (i.e., no hexagonal boron nitridepowder). Comparison sample composite CS2 included non-modified hexagonalboron nitride powder combined in a polybutadiene polymer matrix with a10% mass ratio of nitride powder to poly matrix.

Peel strength of sample polymer based composite S1, comparison samplecomposite CS1 and comparison sample composite CS2 was measured andrecorded. Peel strength was measured according to IPC standard 2.4.9.

Peel strength measurements are summarized in Table 1 below:

TABLE 1 Peel Strength PEEL STRENGTH SAMPLE (N/in) S1 20.1 CS1 19.0 CS214.8

FIG. 4 illustrates a plot of the peel strength for each sample polymerbased composite S1, CS1 and CS2.

Example 2

Sample polymer based composites S2-S4 were formed according toembodiments described herein. Specifically, S2 included oligomerfunctionalized hexagonal boron nitride powder formed according toembodiments described herein and combined in a polybutadiene polymermatrix with a 20% mass ratio of nitride powder to polymer matrix. S3included oligomer functionalized hexagonal boron nitride powder formedaccording to embodiments described herein and combined in apolybutadiene polymer matrix with a 30% mass ratio of nitride powder topolymer matrix. S4 included oligomer functionalized hexagonal boronnitride powder formed according to embodiments described herein andcombined in a polybutadiene polymer matrix with a 40% mass ratio ofnitride powder to polymer matrix.

For purposes of comparison, two comparison sample composites CS3 and CS4were formed. Comparison sample composite CS3 included a polybutadienepolymer matrix with no fillers (i.e., no hexagonal boron nitridepowder). Comparison sample composite CS4 included non-modified hexagonalboron nitride powder combined in a polybutadiene polymer matrix with a20% mass ratio of nitride powder to poly matrix.

Thermal conductivity of sample polymer based composites S2-S4,comparison sample composite CS3 and comparison sample composite CS4 wasmeasured and recorded. Thermal conductivity was calculated as theproduct of thermal diffusivity, density and heat capacity. Moreparticularly, through plane thermal conductivity was calculated as theproduct of the through plane thermal diffusivity, the density and theheat capacity. The thermal diffusivity of each sample was measuredaccording to the standard ASTM C-518 by the thermal flows method. Thediffusivity of each sample was measured perpendicularly to the compositepolymer layer. The heat capacity of each sample was measured by DSC(differential scanning calorimetry) on a Netzsch thermobalance. Thedensity of each sample was measured by Helium pycnometry.

Thermal conductivity measurements are summarized in Table 2 below:

TABLE 2 Thermal Conductivity THERMAL CONDUCTIVITY SAMPLE (W/mK) CS2 0.1S2 0.239 S3 0.287 S4 0.372 CS4 0.129

The above-disclosed subject matter is to be considered illustrative, andnot restrictive, and the appended claims are intended to cover all suchmodifications, enhancements, and other embodiments, which fall withinthe true scope of the present invention. Thus, to the maximum extentallowed by law, the scope of the present invention is to be determinedby the broadest permissible interpretation of the following claims andtheir equivalents, and shall not be restricted or limited by theforegoing detailed description.

The Abstract of the Disclosure is provided to comply with Patent Law andis submitted with the understanding that it will not be used tointerpret or limit the scope or meaning of the claims. In addition, inthe foregoing Detailed Description, various features may be groupedtogether or described in a single embodiment for the purpose ofstreamlining the disclosure. This disclosure is not to be interpreted asreflecting an intention that the claimed embodiments require morefeatures than are expressly recited in each claim. Rather, as thefollowing claims reflect, inventive subject matter may be directed toless than all features of any of the disclosed embodiments. Thus, thefollowing claims are incorporated into the Detailed Description, witheach claim standing on its own as defining separately claimed subjectmatter.

What is claimed is:
 1. An oligomer functionalized nitride particlecomprising: a nitride particle; an aromatic compound covalently bondedvia a urethane moiety to the nitride particle; and at least twooligomers covalently bonded to the aromatic compound via at least twoauxiliary moieties of the aromatic compound.
 2. The oligomerfunctionalized nitride particle of claim 1, wherein the nitride particleis a boron nitride particle or a silicon nitride particle.
 3. Theoligomer functionalized nitride particle of claim 1, wherein the nitrideparticle is a hexagonal boron nitride particle.
 4. The oligomerfunctionalized nitride particle of claim 1, wherein a majority of anymoieties connecting the nitride particle and the aromatic compound areurethane moieties.
 5. The oligomer functionalized nitride particle ofclaim 1, wherein the aromatic compound comprises at least one aromaticring, at least two aromatic rings, at least three aromatic rings.
 6. Theoligomer functionalized nitride particle of claim 1, wherein thearomatic compound comprises a phenyl moiety, a biphenyl moiety, anaphthyl moiety, a phenanthryl moiety, a methylene-diphenyl moiety, atriphenyl-methane moiety.
 7. The oligomer functionalized nitrideparticle of claim 1, wherein the aromatic compound comprises a phenylmoiety.
 8. The oligomer functionalized nitride particle of claim 1,wherein the aromatic compound comprises a biphenyl moiety.
 9. Theoligomer functionalized nitride particle of claim 1, wherein the atleast two auxiliary moieties are amino groups (—NH2), hydroxyl groups(—OH), fluoro groups (—F), chloro groups (—Cl), bromo groups (—Br), iodogroups (—I), carboxyl groups (—COOH), cyano groups (—CN), cyanate groups(—OCN), isocyanate groups (—NCO), thiol groups (—SH), or thioisocyanategroups (—NCS).
 10. The oligomer functionalized nitride particle of claim1, wherein the at least two auxiliary moieties are amino groups (—NH2).11. The oligomer functionalized nitride particle of claim 1, wherein theat least two auxiliary moieties are hydroxyl groups (—OH).
 12. Theoligomer functionalized nitride particle of claim 1, wherein thearomatic compound comprises two isocyanate moieties, three isocyanatemoieties, four isocyanate moieties, five isocyanate moieties.
 13. Theoligomer functionalized nitride particle of claim 1, wherein thearomatic compound comprises three isocyanate moieties.
 14. The oligomerfunctionalized nitride particle of claim 1, wherein the aromaticcompound comprises four isocyanate moieties.
 15. The oligomerfunctionalized nitride particle of claim 1, wherein the at least twooligomers comprise silicone/siloxane, phenolic resin, epoxy resin,poly-butadiene, polyimides, polyester resin, polyurethane, poly(methylmethacrylate) (PMMA), Acrylonitrile butadiene styrene (ABS), polylacticacid, polybenzimaidazole (PBO and PBI), polycarbonate (PC), polyethersulfone (PES), poly ether ether ketone (PEEK), polyetherimide (PEI),polyethylene (PE), polyphenylene oxide (PPO), polyphenylene sulfide(PPS), polyether sulfone (PES), polysulfone (PS), polypropylene (PP),polystyrene (PS), polyvinyl chloride (PVC), poly(dimethylsiloxane) or afluoropolymer.
 16. The oligomer functionalized nitride particle of claim1, wherein the at least two oligomers comprise silicone/siloxane. 17.The oligomer functionalized nitride particle of claim 1, wherein the atleast two oligomers comprise phenolic resin.
 18. The oligomerfunctionalized nitride particle of claim 1, wherein the at least twooligomers comprise silicone/siloxane, phenolic resin, epoxy resin,poly-butadiene, polyimides, polyester resin, polyurethane, poly(methylmethacrylate) (PMMA), Acrylonitrile butadiene styrene (ABS), polylacticacid, polybenzimaidazole (PBO and PBI), polycarbonate (PC), polyethersulfone (PES), poly ether ether ketone (PEEK), polyetherimide (PEI),polyethylene (PE), polyphenylene oxide (PPO), polyphenylene sulfide(PPS), polyether sulfone (PES), polysulfone (PS), polypropylene (PP),polystyrene (PS), polyvinyl chloride (PVC), poly(dimethylsiloxane) or afluoropolymer.
 19. The oligomer functionalized nitride particle of claim1, wherein the at least two oligomers comprise PTFE, ETFE, FEP, ECTFE orPFA.
 20. The oligomer functionalized nitride particle of claim 1,wherein the at least two oligomers comprise PTFE.